Temperature control element and temperature control device for a vehicle

ABSTRACT

A temperature control element for a vehicle is provided that includes a first Peltier element layer, a second Peltier element layer, a first electrically conductive heat conductor layer for conducting a first heat transfer fluid and a second electrically conductive heat conductor layer for conducting a second heat transfer fluid, wherein the first Peltier element layer, the second Peltier element layer, the first heat conductor layer, and the second heat conductor layer are disposed in the form of a stack, so that the first heat conductor layer and/or the second heat conductor layer is disposed between the first Peltier element layer and the second Peltier element layer, and wherein an electrical current conducted through the stack brings about a temperature control of the first heat conductor layer and the second heat conductor layer due to a Peltier effect.

This nonprovisional application is a continuation of InternationalApplication No. PCT/EP2011/054878, which was filed on Mar. 30, 2011, andwhich claims priority to German Patent Application No. DE 10 2010 013467.8, which was filed in Germany on Mar. 30, 2010, German PatentApplication No. DE 10 2010 019 794.7, which was filed in Germany on May6, 2010, German Patent Application No. DE 10 2010 027 470.4, which wasfiled in Germany on Jul. 16, 2010, and German Patent Application No. DE10 2010 043 620.8, which was filed in Germany on Nov. 9, 2010, and whichare all herein incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a temperature control element and atemperature control device for a motor vehicle, particularly for anelectric or hybrid vehicle.

2. Description of the Background Art

No combustion waste heat for heating the passenger area is available inelectric vehicles. Electrically resistive heating requires aconsiderable increase in battery capacity, which is generally verycost-intensive. Alternative heating methods and also cooling methods aretherefore sought to reduce the need for electric power to maintainpassenger comfort.

PTC auxiliary heaters or PTC thermistor auxiliary heaters are apossibility for electric vehicles without having to carry a fuel such asgasoline, bioethanol, etc., to cover the heating requirement for thepassenger compartment in colder times of the year. PTC auxiliary heatersdisposed on the air side are already being mass-produced for vehicleswith at times limited waste heat, for instance, for modern dieselvehicles during a cold start. A form of realization here is, forexample, a heater principle with layers of ribbing, glued one on top ofthe other, with PTC stones between the layers. In fact, this design isespecially simple, because no frame, housing, tube, or the likesurrounding the heating unit or parts thereof are needed, but there is aserial material connection with the particular adjacent layers becauseof the adhesive bonds. Because in this simple construction the ribbingitself carries current, but it is suitable solely for low voltageapplications, e.g., for the 12 V on-board electrical system.

Another approach is a realization of a heating unit using Peltiertechnology. In this regard, e.g., prototypes of a heating unit with analternative cooling function to support the AC circuit have already beenproposed. In these prototypes, however, the design principle appears tobe relatively complicated and three-dimensional; e.g., a great depth isnecessary. The Peltier effect of thermoelectric materials is alreadyutilized in niche applications for cooling, for instance, cooling ofelectronic components or in camping coolers. For applications in theautomobile, the efficiency has been regarded thus far as being too low;in contrast the converse effect of current generation from temperaturedifferences by means of thermoelectrics in the exhaust gas line ofvehicles driven by internal combustion engines is propagated bywell-known manufacturers in expert circles and developed in thedirection of mass-production readiness. Thus far, the conventionalcooling circuit is employed for air conditioning the passenger area, andelectrical resistance heaters are largely relied upon for heating infirst generation electric vehicles.

In the case of purely electric heating, high-cost electrical energy isconverted to low-cost thermal energy. Two observations indicateotherwise. On the one hand, provision of electrical storage capacity,e.g., by means of Li-ion batteries, costs about 500-700

/kWh. The thus far envisaged technologies with Peltier elements are morecostly to realize than heating with PTC auxiliary heaters because of thegreater complexity of the electrical interconnections of alternating p-and n-doped components in the electrical series connection. Electricalinsulators are usually also thermally insulating and worsen the heattransfers. The thermoelectrics at high driving temperature gradients areaffected even more greatly than conventional heat pumps by the reductionof the COP or efficiency. Resistance heaters achieve only a COP=1 andhave a great negative effect on the cruising range of the electricvehicle. The cooling circuit in principle works with an acceptable COP,but contains many individual components and must be topped up regularlywith coolant. Overall, separate units for heating (heating unit) andcooling (cooling circuit) must be installed for each of the twofunctions.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide animproved temperature control element and an improved temperature controldevice.

The present invention is based on the realization that by a skillfulseries connection of Peltier elements, a heating or cooling unit in thelayer design can be enabled in such a way that in each case similarlydoped Peltier elements are arranged adjacent in a layer.

The use of Peltier elements differs from the use of PTC stones, amongothers, in the fact that two differently doped materials, therefore p-and n-doped elements, are interconnected. By default, the Peltierelements form such a configuration that a hot side of two differentlydoped Peltier elements and a cold side of two differently doped Peltierelements are connected in an electrically conducting manner, so that aseries connection results overall. This type of configuration, however,can hardly be applied directly to a production-suitable heating orcooling unit, because the metallic conductors do not form a continuousbar, which goes beyond two differently doped, directly adjacentelements. The breaks could be bridged only by an electricalnonconductor. These nonconductors represent an obstacle for heattransfer on both sides.

The approach of the invention describes a heating unit with a possiblecooling function for heating or cooling the passenger area of anelectric vehicle, which can be produced as cost-effectively as possiblewith the lowest possible effort and already usable productiontechnologies, and in addition has a high efficiency through heattransfer optimization.

A heating unit of the invention may have simple to produce, continuousbars for a ribbing and continuous channels for cooling water, which aremade as electrical conductors. A high heat transfer can be realized byas direct as possible thermal connection of the Peltier elements on aliquid and/or air side; this can be attributed in particular to the factthat no electrical insulators are present in this area as heat barriers.Advantageously, this type of combination of series and parallelconnections can be adjusted to 12 V. The heat transfer at ribs on theair side and a cooling water channel can be made two-sided according toan embodiment. This type of structure offers the further advantage thata possible thermal insulation effect of a galvanic separation, e.g.,between the ribs, is not problematic, because there is no temperaturegradient here owing to the symmetry requirement. Overall, there is animportant advantage in a smallest possible departure from heating unitsalready produced according to existing production methods, e.g., withPTC auxiliary heaters, with a simultaneously optimal heat transfer.Therefore, an optimal efficiency or COP (coefficient of performance)results. A basic design formed according to the approach of theinvention here thus offers the advantage that it differs substantiallyin two points from a heating unit with a material connection. First,cooling water channels are already present as heat sources, for aheating mode, or as heat sinks, for a cooling mode. And second, anelectrical insulation layer is present in the middle between thecorrugated ribs. Operation of a heating unit of the invention withPeltier elements for a heating or cooling mode is accordingly such thatnet heat flows in sum occur only in the vertical direction and are to beunderstood in this way.

Advantageously, heating without combustion waste heat with a COP>1 and acombination of the functions of cooling and heating in one structure arepossible. In addition, elimination of coolants and a simpledecentralization through modularity result, because of the repeatinglayers and a repeating planar structure within a layer.

The present invention provides a temperature control element for avehicle, with the following features: a first Peltier element layer; asecond Peltier element layer; a first electrically conductive heatconductor layer for conducting a first heat transfer fluid; and a secondelectrically conductive heat conductor layer for conducting a secondheat transfer fluid, whereby the first Peltier element layer, the secondPeltier element layer, the first heat conductor layer, and the secondheat conductor layer are arranged in the form of a stack, so that thefirst heat conductor layer and/or the second heat conductor layer arearranged between the first Peltier element layer and the second Peltierelement layer, and whereby an electric current conducted through thestack brings about a temperature control of the first heat conductorlayer and the second heat conductor layer due to a Peltier effect.

The temperature control element can be used, for example, in an electricor hybrid vehicle, to control the temperature of a passenger cell in thevehicle. Temperature control in this case can mean both heating andcooling. The first Peltier element layer and the second Peltier elementlayer can be formed from two differently doped semiconductor materials.Thus, for example, the first Peltier element layer can be n-doped andthe second Peltier element layer p-doped or, vice versa, the firstPeltier element layer can be p-doped and the second Peltier elementlayer n-doped. Instead of semiconductor materials, other suitableconductors can also be used for the Peltier element layers. The firstand second electrically conductive heat conductor layer can be made froma highly conductive metal. A current applied to the temperature controlelement can enter at one end of the stack into the temperature controlelement, pass through the entire stack, and again leave it at anopposite end, for example, via suitable contacts that are connected toan electrical line. A heat transfer fluid can flow through the first andsecond electrically conductive heat conductor layer. The first andsecond heat conductor layer can be arranged in the stack relative to thefirst and second Peltier element layer, so that a temperature generatedby the Peltier effect can be transferred to the heat transfer fluidbeing conducted in said layer. According to the Peltier effect and thearrangement of the heat conductor layers in regard to the Peltierelement layers, one of the heat transfer fluids is always heated and theother cooled during operation of the temperature control element. Thefirst and second heat transfer fluid can be in each case, e.g., a gas ora fluid. According to a temperature control element task to be achieved,one of the heat transfer fluids can be used to be conducted to apassenger cell of the vehicle in order to cool or heat said cell. If thecurrent flow in the temperature control element is reversed, the heattransfer fluid, which was previously heated by the temperature controlelement, can now be cooled or vice versa. To prevent a leakage currentvia the heat transfer fluid, electrical insulation can be arrangedbetween the heat transfer fluid and a surface, facing the heating fluid,of the heat conductor layer.

According to an embodiment, the temperature control element can comprisean additional first electrically conductive heat conductor layer and inaddition or alternatively an additional second electrically conductiveheat conductor layer. In this case, the additional first and/oradditional second heat conductor layer can be arranged in the stackseparated by at least one of the first or second Peltier element layerfrom the first or second heat conductor layer. For example, the stackcan be structured so that the additional second heat conductor layer, onwhich the first Peltier element layer is arranged, is located at thevery bottom of the stack. On this layer, the first heat conductor layer,on which the second Peltier element layer is located, can be arranged inturn. The second heat conductor layer can form the closure of thetemperature control element stack. Alternatively, the stack can be builtso that the additional first heat conductor layer forms the first layerof the stack. On this layer, for example, the first Peltier elementlayer, the second heat conductor layer, the first heat conductor layer,the second Peltier element layer, and the additional second heatconductor layer can be arranged one after another, whereby a thermalinsulation layer can be arranged between the second heat conductor layerand the first heat conductor layer.

In case that the temperature control element comprises an additionalsecond electrically conductive heat conductor layer, the second heatconductor layer can have a first electrical contact and the additionalsecond heat conductor layer a second electrical contact. In this case,the first Peltier element layer and the second Peltier element layer canbe arranged between the second heat conductor layer and the additionalsecond heat conductor layer. The first heat conductor layer can bearranged between the first Peltier element layer and the second Peltierelement layer. According to this arrangement, a first Peltier effect canbe achieved at the first heat conductor layer, so that the first heatconductor layer can be heated or cooled according to a polarity of thecurrent conducted through the stack. According to a Peltier effectopposite to the first Peltier effect, the second heat conductor layercan be heated when the first heat conductor layer is cooled or cooledwhen the first heat conductor layer is heated. This arrangement offersthe further advantage that no thermally insulating layer is neededbetween the individual layers and differently temperature-controlledheat conductor layers are always separated by a Peltier element layer.In a stacking of the temperature control element with another similartemperature control element, moreover, only a galvanic separation and nothermogalvanic separation between the temperature control elements arenecessary, because here two heat conductor layers are arranged adjacentto one another that are exposed to the same Peltier effect and thus havea similar temperature.

Alternatively, the temperature control element can comprise anadditional first heat conductor layer and an additional second heatconductor layer. The first heat conductor layer can have a firstelectrical contact, and the additional first heat conductor layer canhave a second electrical contact. Further, the temperature controlelement can have an electrical line for connecting the second heatconductor layer to the additional second heat conductor layer. In thisregard, the first heat conductor layer and the second heat conductorlayer can be arranged between the first and second Peltier element layerand the first Peltier element layer and the second Peltier element layerare arranged between the additional first heat conductor layer and theadditional second heat conductor layer. A galvanic and thermalinsulation layer can be arranged, moreover, between the first heatconductor layer and the second heat conductor layer. According to thisarrangement, an electric current can enter the temperature controlelement at the first electrical contact and from there pass through thesecond Peltier element layer, the second heat conductor layer, and viathe electrical line the additional second heat conductor layer, thefirst Peltier element layer, and finally the additional first heatconductor layer. At the second electrical contact, the electric currentcan be conducted out of the temperature control element and perhaps intoan additional temperature control element.

According to a further embodiment, the different heat conductor layersof the temperature control element can also be connected together viaadditional electrical lines. The additional lines in this regard can bearranged in each case at the ends, opposite to the lines, of theparticular heat conductor layers of the temperature control element.Accordingly, the heat conductor layers provided with a first or secondcontact can each have additional contacts for connecting the additionallines. This type of two-sided supplying and removal of the electriccurrent on the left and right at the temperature control element, forexample, by means of cables, can contribute to reducing the currentstrengths in the bars or ribs of the various heat conductor layers ofthe temperature control element. The disadvantage that in case of aone-sided connection the current strength at the entrance into the heatconductor layer, namely, the sum of all currents through the Peltierelement conductors would correspond to a series, which can lead tounallowable current densities, can thereby be eliminated.

The first Peltier element layer can have at least two first Peltierelement conductors arranged adjacent to one another, and the secondPeltier element layer can have at least two second Peltier elementconductors arranged adjacent to one another. A distance between theindividual Peltier elements can be selected depending on a heat outputof the Peltier element conductors. An electrical insulation can bearranged between the individual Peltier element conductors. Depending onthe expanse of the Peltier element layers, accordingly many Peltierelement conductors can be arranged adjacent to one another. In thisregard, the Peltier element conductors can be arranged in a planarmanner, therefore, for example, next to one another in both thelongitudinal and transverse direction.

According to an alternative embodiment, the first Peltier element layerand the second Peltier element layer can each have at least one firstPeltier element conductor and at least one second Peltier elementconductor. The first and second Peltier element conductor in this regardcan be arranged adjacent to one another and be connected in anelectrically conductive manner. As a result, the electric currentconducted through the stack can flow serially through the first Peltierelement conductor and second Peltier element conductor. For example, thefirst Peltier element conductor can be n-doped and the second Peltierelement conductor can be p-doped, or vice versa. This embodiment of thetemperature control element offers the advantage that perhaps alreadyavailable prototypes of heating elements based in Peltier technology canbe used for constructing the temperature control element proposed here.This results in a saving of time and cost during production.

According to an embodiment, the first heat conductor layer can beconfigured as a coolant channel and the second heat conductor layer canbe configured as a rib element. For example, the coolant channel can beformed as a tube for carrying a coolant fluid. The rib element can beformed, for example, from two bars, between which a zigzag-shaped orwavelike bent metal band is arranged, so that, for example, obliquelyarranged ribs are formed between the bars. The second heat transferfluid, for example, can be air, which is brought into the vehicle fromthe vehicle environment and is passed through the second heat conductorlayer, where it is cooled or heated according to a temperature of thesecond heat conductor layer. This type of structure for the second heatconductor layer advantageously offers a large temperature transfer areafor the fluid passed through the second heat conductor layer. Of course,the first heat conductor layer can be configured to carry air and thesecond heat conductor layer to carry a fluid. Likewise, the first heatconductor layer can have a plurality of adjacently arranged coolantchannels and the additional heat conductor layer can have a plurality ofadjacently arranged rib elements.

The first heat conductor layer can have a galvanic insulation layer onan outer side. It can be surrounded by a conductor layer, which can beformed to enable a current flow between the first Peltier element layerand the second Peltier element layer. For example, the first heatconductor layer can be surrounded completely by the conductor layer, orthe conductor layer can be applied to two opposite sides of the firstheat conductor layer and be connected to an electric line. The electriccurrent flow through the temperature control element stack can beassured in this way, whereby at the same time the first heat conductorlayer is excluded from an electric current flow. Thus, leakage currentsin the coolant flowing through the first heat conductor layer can beprevented.

The first heat conductor layer and the second heat conductor layer canbe configured to provide flow directions, orthogonal to one another, forthe first heat transfer fluid and the second heat transfer fluid. Inthis way, inlets and outlets for the different heat transfer fluids canbe arranged on different sides of the temperature control element.

The present invention provides further a temperature control device,which comprises a plurality of temperature control elements, whereby theplurality of temperature control elements are interconnected in a seriesconnection via the respective first and second contacts.

According to an embodiment, a galvanic insulation layer can be arrangedbetween two each of the plurality of temperature control elements. Inthis way, an electric current flow can be assured one after the otherthrough all temperature control elements of the temperature controldevice. Contacts of a first and last temperature control device inregard to the current flow can be connected to a current source.Galvanic insulation layers arranged between adjacent temperature controlelements can, moreover, provide a thermal insulation between theindividual temperature control elements. This is especially importantwhen two differently temperature-controlled heat conductor layers arearranged adjacent to one another in the temperature control device. Thetemperature control elements can be interconnected both in a seriesconnection and in a parallel connection or in a combination form in thetemperature control device.

The plurality of temperature control elements can be arranged in atleast one stack. In this regard, a dimension of the temperature controldevice can be adapted to existing spatial circumstances by a suitablenumber of stacked temperature control elements and/or a horizontalextent of the individual layers of the plurality of temperature controlelements. Of course, the temperature control device can also be formedfrom a plurality of stacks, which are arranged adjacently and areconnected via the respective contacts in a series or parallelconnection.

The present invention provides further a temperature control device fora vehicle, with the following features: a first heat conductor layer forconducting a first heat transfer fluid; a Peltier element layer whichhas a plurality of Peltier elements, which are arranged spaced apartfrom one another and each comprise a plurality of Peltier elementconductors; and a second heat conductor layer for conducting a secondheat transfer fluid, whereby the layers are arranged in the form of astack, so that the Peltier element layer is arranged between the firstheat conductor layer and the second heat conductor layer. Duringoperation of the temperature control device, the Peltier element layercan be configured to cool the first heat conductor layer and to heat thesecond heat conductor layer, or vice versa. Each Peltier element can bemade as a separate Peltier module. This means that each Peltier elementhas its own electrical connections for supplying and removing a currentflowing through the Peltier element conductors of the Peltier element.The Peltier elements can each have a base plate on which solely thePeltier element conductors of the particular Peltier element arearranged. A distance between adjacent Peltier element conductors withina Peltier element can be smaller than a distance between adjacentPeltier elements. The Peltier elements can have both n-doped Peltierelement conductors and p-doped Peltier element conductors. The Peltierelement conductors can also be made as vapor-deposited conductive tracksor as a textile.

The plurality of Peltier elements of a Peltier element layer can cover amaximum of a tenth of the total area of the Peltier element layer. Athermally insulating interspace can be located between the Peltierelements. Alternatively, the plurality of Peltier element conductors cancover a maximum of a tenth of the total area of the Peltier elementlayer.

According to an embodiment, the temperature control device can have anadditional Peltier element layer, which has a plurality of additionalPeltier elements, which are arranged spaced apart from one another andin each case comprise a plurality of additional Peltier elementconductors, and an additional first heat conductor layer for conductingthe first heat transfer fluid. In this regard, the additional Peltierelement layer can be arranged in the stack between the second heatconductor layer and the additional first heat conductor layer. In thisway, no thermal insulation is needed between adjacent layers.

Alternatively, the temperature control device can have a thermalinsulation layer, an additional first heat conductor layer forconducting the first heat transfer fluid, and an additional Peltierelement layer, which has a plurality of additional Peltier elements(600), which are arranged spaced apart from one another and eachcomprise a plurality of additional Peltier element conductors. In thisregard, the thermal insulation layer can be arranged in the stackadjacent to the second heat conductor layer and the additional firstheat conductor layer in the stack between the thermal insulation layerand the additional Peltier element layer.

According to an embodiment, a temperature control device has a switchingdevice, which is configured to conduct the first heat transfer fluid ina first operating mode of the temperature control device through thefirst heat conductor layer and the additional first heat conductor layerand in a second operating mode of the temperature control device eitherthrough the first heat conductor layer or through the additional firstheat conductor layer. The temperature control element can be designed asa flap. The temperature control device can achieve a higher heat outputin the first operating mode than in the second operating mode.Advantageously, an electric current, which has an optimal currentstrength for operating the Peltier element conductors, can flow throughactive Peltier element conductors both in the first operating mode andin the second operating mode.

According to an embodiment, adjacently arranged Peltier element layers,for example, the first Peltier element layer and the second Peltierelement layer, can have a different number of Peltier element conductorsor Peltier elements. Alternatively or in addition, an arrangement ofPeltier element conductors or Peltier elements on adjacently arrangedPeltier elements layers can be different. Alternatively or in addition,an extended area for the Peltier element conductors or the Peltierelements on the adjacently arranged Peltier element layers can bedifferent. A temperature distribution within the Peltier element layerscan be influenced by a suitable selection of the arrangement, number,and/or size. A homogeneous temperature distribution in particular can beachieved.

Further scope of applicability of the present invention will becomeapparent from the detailed description given hereinafter. However, itshould be understood that the detailed description and specificexamples, while indicating preferred embodiments of the invention, aregiven by way of illustration only, since various changes andmodifications within the spirit and scope of the invention will becomeapparent to those skilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from thedetailed description given hereinbelow and the accompanying drawingswhich are given by way of illustration only, and thus, are not limitiveof the present invention, and wherein:

FIG. 1 is a schematic diagram of a temperature control device accordingto an exemplary embodiment of the present invention;

FIG. 2 is a schematic diagram of a temperature control device accordingto a further exemplary embodiment of the present invention;

FIG. 3 is an enlarged illustration of a detail of the temperaturecontrol device of FIG. 2;

FIG. 4 is a schematic diagram of a temperature control device accordingto a further exemplary embodiment of the present invention;

FIG. 5 is a schematic diagram of a series connection of a plurality oftemperature control devices according to a further exemplary embodimentof the present invention;

FIG. 6 is a schematic diagram of a Peltier element of a furtherexemplary embodiment of the present invention;

FIG. 7 is a schematic diagram of a Peltier element layer according to anexemplary embodiment of the present invention;

FIG. 8 is a schematic diagram of a temperature control device accordingto an exemplary embodiment of the present invention;

FIG. 9 is an exploded diagram of a section of a temperature controldevice according to an exemplary embodiment of the present invention;

FIG. 10 is a schematic diagram of a Peltier element layer and a Peltierelement according to an exemplary embodiment of the present invention;and

FIG. 11 is a projection of two Peltier element layers according to anexemplary embodiment of the present invention.

DETAILED DESCRIPTION

In the following description of the exemplary embodiments of the presentinvention, the same or similar reference characters are used forelements with a similar action and shown in the various drawings,whereby a repeated description of these elements is omitted.

FIG. 1 shows a schematic diagram of a temperature control device 100according to an exemplary embodiment of the present invention.Temperature control device 100 is formed here by a stack of fourtemperature control elements 105. For the sake of clarity, only one oftemperature control devices 105 is provided with a reference character.Temperature control device 100 can also have more or fewer temperaturecontrol elements 105.

Each temperature control device 105 in FIG. 1 has a first Peltierelement layer 110, a second Peltier element layer 115, a first heatconductor layer 120, a second heat conductor layer 125, and anadditional second heat conductor layer 130. According to theillustration in FIG. 1, second heat conductor layer 125 forms the baseof the stack. On this layer, first Peltier element layer 110 isarranged, on which in turn first heat conductor layer 120 is arranged.It is covered by second Peltier element layer 115, on which finallythere is the additional second heat conductor layer 130. According tothe illustration in FIG. 1, first Peltier element layer 110 and secondPeltier element layer 115 each include three individual spaced-apart,adjacently arranged Peltier element conductors 135. For the sake ofclarity, only one of the Peltier element conductors 135 is provided witha reference character. According to the illustration in FIG. 1, Peltierelement conductors 135 in first Peltier element layer 110 are n-dopedand Peltier element conductors 135 in second Peltier element layer 115are p-doped.

In the exemplary embodiment of temperature control device 100 in FIG. 1,first heat conductor layer 120 is configured in each case as a coolantchannel. Second heat conductor layer 125 and additional second heatconductor layer 130 are each made as a rib element with two parallelbars and ribs arranged obliquely between the bars. A galvanic insulationlayer 140 is arranged between two adjacent temperature control elements105. For the sake of clarity, only one of the galvanic insulation layers140 is labeled with a reference character. Optionally, one of the twobars of rib elements 130 can also be omitted, for example, when twotemperature control elements 105 follow one another in the stack, sothat a second heat conductor layer 125 is adjacent to a temperaturecontrol element 105, and is arranged separated perhaps only by agalvanic insulation layer 140 from another second heat conductor layer130 of a following temperature control element 105. Here, for example,in each case the bar adjacent to insulation layer 140 can be omitted.Adjacent layers can be in direct contact to one another.

According to the exemplary embodiment of temperature control device 100as shown in FIG. 1, each second heat conductor layer 125 has a firstelectrical contact 145 and additional second heat conductor layer 130 asecond electrical contact 150. To produce an electrical seriesconnection between temperature control elements 105 each time a secondcontact 150 of a temperature control element 105 is connected to a firstcontact 145 of an adjacent temperature control element 105 via anelectrical line 155. According to the illustration in FIG. 1, firstcontact 145 of the topmost temperature control element 105 intemperature control device 100 and second contact 150 of the lowesttemperature control element 105 are connected to an electrical supplyline or discharge line, so that a current introduced by the supply linein temperature control device 100 flows through the entire stack and canagain leave it through the discharge line.

Each heating unit or each temperature control element 105, according tothe illustration in FIG. 1, contains a coolant channel 120 and airpassages 125, 130. Heat is transported over Peltier elements 135 betweenthe coolant and Peltier elements 135 and between Peltier elements 135and ribbed air side 125, 130. A design principle that is simple toproduce can be achieved by the advantageous electrical interconnection155. In addition, heating unit 105 manages without electricalinsulators, which generally would negatively affect heat conductionproperties in areas of high required heat transfer.

Coolant flows through coolant channels 120. Peltier elements 135 areattached to these on both sides, so that heat transfer can occur in bothdirections. The heat is transferred via Peltier elements 135 and reachesthe ribbed air side 125, 130, and ribs 125, 130 facilitate the heattransfer to the air. This heat path is also made electricallycontinuously conductive, because the electrically conductive heatconductor layers 120, 125, 130 are made of metal, e.g., aluminum, andPeltier elements 135 contain thermoelectrically active functionalmaterial. Electrical insulation layer 140 is located in the middlebetween corrugated ribs 125, 130. A possible heat transfer resistance byinsulation layer 140 plays no role, because according to the symmetry noheat transfer occurs here in the vertical direction within the meaningof the operating principle.

Peltier elements 135 in FIG. 1 are configured in a row (layer) and areexclusively p- or n-doped. The electrical interconnection 155 occurs insuch a way that an enlargement of temperature control device 100 in thevertical direction by an increase in the number of layers of temperaturecontrol elements 105 brings about an increase in the total voltage dropat temperature control device 100. In the exemplary embodiment shown inFIG. 1, temperature control device 100 comprises four layers oftemperature control elements 105 each with an identical internalstructure. In contrast, a horizontal enlargement of temperature controldevice 100 brings about a greater current strength, because all elementsin a layer are connected electrically in parallel.

According to the illustration in FIG. 1, the rib elements or air sides125, 130 of two adjacent vertical layers are connected by a separateelectrical conductor 155, which is symbolized as a “cable” in theillustration, in such a way that the Peltier elements 135, attacheddirectly on an air side 125, 130, have a different doping. Theconnection between two layers at Peltier elements 135, which areattached to the same coolant channel 120, need not be bridged byseparate conductors, because coolant channel 120 itself is electricallyconductive.

Depending on the construction, naturally also layers not directlyadjacent could be interconnected together, but adjacent layers becauseof the shortest needed line length are obvious and to be preferred.Likewise, a temperature control element layer 105 could be rotated 180°,so that the same doping does not always lie on top and the other dopingon the bottom. However, the always invariable arrangement of the layersof temperature control elements 105, as shown in FIG. 1, is useful forerror prevention during production. Electrical connections 145, 150 areattached as shown in FIG. 1, so that they are integrated seamlessly intothe interconnection principle. As already described, the number oflayers of temperature control elements 105 defines the range of thevoltage drop at heating unit 100. If it were to be too high at a givenheight of heating unit 100, the electrical interconnection can beinterrupted by additional electrical supply lines. According to anexemplary embodiment, the heating unit section of FIG. 1 can bereplicated precisely and placed at the top on the existing section. Theseparation would then be purely electrical, and the mechanicalattachment could be made similar to the connection between the otherlayers. A too low voltage drop would more likely be expected, however,for example, when the voltage made available by a voltage source is tobe tapped as completely as possible, for instance, 12 V in a low-voltageon-board electrical system of the vehicle. In this case, there is thepossibility as well of an expanded electrical series connection by anarrangement of a number of such heating units 100 in a previously notutilized depth dimension in a row, so that the free flow cross sectionon the air side is retained. This aspect of the approach of theinvention is explained in conjunction with FIG. 5.

In summary for the exemplary embodiment of temperature control device100, as shown in FIG. 1, the current flow can again be described asfollows: The current flows through a row of Peltier elements 135 withthe same doping, in a parallel connection, to cooling water channel 120and through this channel to a row of differently doped elements 135,which are also connected in series. Via the air side 125, here a ribbingor a base plate with, e.g., ribs applied by soldering, there is anelectrical connection 150 to a separate conductor 155, of possiblerandom design, which causes the current flow in the ribbing or baseplate 130 with, e.g., ribs, applied by soldering, of another layer 105.Accordingly, the doping changes in the electrical series connection ofadjacent elements.

FIG. 2 shows a schematic diagram of a temperature control device 200according to a further exemplary embodiment of the present invention.Temperature control device 200 has a structure that is virtuallyidentical to temperature control device 100 of FIG. 1, with thedifference that each temperature control element 105 has an outerelectrical connection 205 for bypassing coolant channel 120. For thesake of clarity, only one of the electrical connections 205 is providedwith a reference character. The use of electrical connections 205 is dueto the fact that as a rule no purely organic coolants are used, butthose that contain a certain amount of water. As a result, the coolantbecomes electrically conductive and would be exposed to a voltagedifference during use in a temperature control device according toFIG. 1. This can be prevented by removing coolant channel 120 from thecurrent cascade: Accordingly, for example, a nonconductor is applied ina thin layer to coolant tube 120, so that a heat transport resistance isas low as possible. A preferably continuous conductive layer is in turnapplied to said layer. Coolant channel 120 itself thus remainspotential-free, but must be bypassed for this by the separate conductor205, as is the case on the air side 125, 130. Conductor 205 can also bedesigned differently than shown in FIG. 2.

FIG. 3 in a detail enlargement shows a structure of a coolant channel120 according to the exemplary embodiment shown in FIG. 2. Shown is asection of coolant channel 120 in a longitudinal section illustration. Agalvanic insulation layer 305 made from an insulator is applied tocoolant channel 120, so that an electrical voltage transmitted to a tubewall 310 cannot be transmitted to a cooling fluid flowing throughcoolant tube 120. A conductor layer 315 made from an electricalconductor is applied over galvanic insulation layer 305. Conductor layer315 in turn has an electrical contact to discharge line 320, which herecan tap the electric current and supply it to conductor layer 315 atanother place, so that the cooling fluid remains excluded from theelectric current flow. Tube wall 310 can be made, for example, ofaluminum.

FIG. 4 in a schematic diagram shows an alternative exemplary embodimentof a temperature control device 400. Temperature control device 400comprises a vertical stack of three temperature control elements 405.These have a structure different from the temperature control elementsexplained in conjunction with FIG. 1. Here, second heat conductor layer125 between first Peltier element layer 110 and second Peltier elementlayer 115 is also arranged next to first heat conductor layer 120. Agalvanic and thermal insulation layer 410 is located between first heatconductor layer 120 and second heat conductor layer 125. The galvanicand thermal insulation layer 410 can have an optional bar for ribelement 125 or rib element 130. The galvanic insulation layer, explainedin regard to FIG. 1, is omitted here. In the exemplary embodiment shownhere, temperature control element 405 has an additional first heatconductor layer 415, which forms a base of temperature control element405. Here, first heat conductor layer 120 has first electrical contact145 and the additional first heat conductor layer 415 second electricalcontact 150. Further, second heat conductor layer 125 of eachtemperature control element 405 is connected via an electrical line 420to additional second heat conductor layer 130.

According to the illustration in FIG. 4, compared with the exemplaryembodiment explained in conjunction with FIG. 1, there is only aone-sided heat transfer each on the cold and hot side. Thus, insulationlayer 410 on the other side now acts not just in an electricallyinsulating manner against low voltage but also in a thermally insulatingmanner. Accordingly, a thickness of insulation layer 410 can be greaterhere. Air sides 125, 130 of adjacent layers are connected electricallyhere via lines 420; likewise cooling water sides 120, 415 of adjacentlayers are no longer connected directly electrically to one another, butanalogous to the air side also indirectly via separate conductors 425.This occurs again in such a way that two electrically connected layers120, 415 or 125, 130 have alternating dopings of Peltier stones 135doped uniformly within a layer.

In regard to the exemplary embodiments explained with the previous FIGS.1 to 4, it is emphasized that, within the scope of the approachpresented here, an absolute sequence, i.e., a beginning and end of aseries connection with a specific doping (p or n), and a number ofPeltier elements in each spatial direction basically remain open. Alsoopen is an operation as a heat pump, whereby air is heated, or as an airconditioning unit, whereby air is cooled. The particular functionalitycan be changed by changing the polarity.

FIG. 5 shows in a schematic diagram an exemplary embodiment of anexpanded electrical series connection 500 of temperature control devices100, 200, or 400 according to FIGS. 1 to 4 in a horizontal direction.The plurality of temperature control devices 100, 200, or 400 is shownin simplified form. According to the illustration in FIG. 5, temperaturecontrol devices 100, 200, or 400 are arranged in a plane one behind theother in a depth direction 510 indicated by an arrow. According tostructural circumstances of the site of use, arrangement 500 shown herecan also be expanded with additional temperature control devices 100,200, or 400. The individual temperature control devices 100, 200, or 400are connected together in an electrically conductive manner, so that acurrent flow can occur through the entire arrangement 500. Theelectrical connections are not shown in FIG. 5. Another arrow representsa flow direction 520 of a heat transfer fluid carried, for example,through the second and additional second heat conductor layers oftemperature control devices 100, 200, or 400. This can be air, forexample.

Alternatively to the exemplary embodiments of temperature controldevices 100, 200, 400, as presented according to FIGS. 1 to 4, a furtherexemplary embodiment of a temperature control device of the inventioncan have a Peltier element layer, which has a plurality of Peltierelements, which in turn have a plurality of Peltier element conductors.Thus, instead of pure n- or p-doped elements 135 externallygeometrically identical elements can be used, which intrinsically haveany desired planar fine structure of n- and p-series connectedcomponents.

FIG. 6 shows a schematic diagram of such a Peltier element 600. Shown isa horizontal arrangement of Peltier element conductors 135. In thisregard, in each case an n-doped Peltier element conductor and a p-dopedPeltier element conductor are arranged alternately in a plane.Adjacently arranged and differently doped Peltier element conductors 135are each connected to one another alternately via an electricalconductor 605 on a hot side and an additional electrical conductor 605on a cold side. There are gaps 610 in the electrical conductors 605 on ahot side or cold side opposite to the particular electrical conductors.An electrical insulator 615 is arranged in each case above and below thelayer of Peltier element conductors 135.

An exemplary embodiment of a temperature control device of the inventioncan be built according to the principle of temperature control devices100, 200, 400 shown in the FIGS. 1 to 4, whereby, however, Peltierelements 600 are used. So that an electric current flow through theentire stack of a temperature control device built in such a way isassured, in contrast to the shown exemplary embodiments 100, 200, 400,here each Peltier element 600 has a supply line and discharge line forthe electric current. In contrast to the exemplary embodiments accordingto FIGS. 1 to 4, the electric current here flows not vertically buthorizontally through the particular Peltier element 600. Possible iseither a serial interconnection between individual Peltier elements 600or a parallel connection, in which each Peltier element 600 is connectedto a central current supply of the vehicle, generally the car battery,so that a voltage drop of 12 V across the entire stack of thetemperature control device is assured.

According to an embodiment, in which Peltier elements 600 are used, acurrent flow occurs not through the entire stack, and particularly notthrough the heat conductor layers, but solely through the Peltierelement layers. The individual Peltier element layers can each beconnected parallel or serially.

Depending on the voltage drop at Peltier elements 600, it would bepossible to also use the electrical interconnection described herebetween the rows to increase further the total voltage drop across theheating unit. Alternatively, simply each row with thermoelectricelements 600 can be treated separately as a single circuit, when, e.g.,the fine structure of Peltier module 600 already causes a voltage dropof 12 V, which corresponds to the conventional functionality. Forexample, an n- or p-component or n- or p-Peltier element conductor canhave a voltage drop of 0.0625 V. With 16 components, this would resultin 1 V for a Peltier element. If heating unit 12 has serially connectedrows, a 12 V voltage drop would be realized overall.

FIG. 7 shows a perspective view of a planar layer, particularly aPeltier element layer 710, according to an exemplary embodiment of thepresent invention. Peltier element layer 710 has a plurality of Peltierelements 600. Peltier elements 600 can each be a module, as is shown,for example, in FIG. 6. The individual Peltier elements 600 are eachseparated from one another by a thermally insulated interspace 712. Aheat flow direction is indicated by an arrow.

FIG. 8 shows a schematic illustration of a temperature control device800, according to an exemplary embodiment of the present invention. Thetemperature control device has a stack of heat conductor layers, ofwhich by way of example an air channel is labeled with referencecharacter 125, and Peltier element layers, of which by way of exampleone is labeled with reference character 710. According to this exemplaryembodiment, warm air flows as indicated by the arrow into temperaturecontrol device 800 and cold air out of temperature control device 800.This means that the Peltier elements are arranged or operated so thatair channels 125 are cooled. In contrast, additional heat conductorlayers of temperature control device 800, through which, for example, acoolant can flow, are heated.

FIG. 9 on the left shows a layer of the temperature control device shownin FIG. 8 and on the right an exploded view of this layer, according toan exemplary embodiment of the present invention. Shown is astack-shaped structure of a first heat conductor layer 120, two secondheat conductor layers 125, and two Peltier element layers 710. Peltierelement layers 710 are each arranged between first heat conductor layer120 and one of the second heat conductor layers 125. First heatconductor layer 120 is designed in the form of a flat coolant channel,through which a coolant 950 flows. Peltier element layers 710 can beconfigured as Peltier layers with electrical contacting and bondedelectrical insulation.

FIG. 10 shows a Peltier element layer 710 and a detailed Peltier element600, according to an exemplary embodiment of the present invention.Peltier element layer 710 can be the Peltier layer used in FIG. 9.

An occupancy rate ε can be less than or equal to 10%:

ε=(sum of the areas of the Peltier elements 600)/(area of layer710)=<10%

Peltier element 600 has a base plate and a cover plate, between which aplurality of Peltier element conductors is arranged. The Peltier elementconductors can be arranged according to the arrangement shown in FIG. 6.

According to the exemplary embodiment shown in FIG. 10, instead of dopedstones entire elements 600 are placed in a layer 710. In this regard, atmost 10% of the area of a layer 710 is occupied by Peltier elements 600.Thus, the integration level can no longer be in the doped P and Nstones, but entire purchased elements can be used, which have aparticular fine structure, i.e., P and N. The fine structure can havestones. Instead of interconnected stones, for example, vapor-depositedconductive tracks or textile can be used.

According to an exemplary embodiment, the approach of the invention canbe used in a thermoelectric heating and air-conditioning device. Adevice with a modular structure is used for heating or cooling theinternal compartment air. The heat absorption or heat dissipation occursvia the low-temperature circuit of the vehicle, preferably an electricvehicle. In order to be economical with commercially availablethermoelectric materials, the basic design of the device is conceivedfor the best possible heat transfer.

In the electric vehicle, heating of the passenger area represents achallenge, because no notable engine waste heat is available. Electricalresistance heaters convert the current stored in the battery with aCOP=1 (coefficient of performance) into heat and reduce the cruisingrange significantly. More efficient are heat pumps that operate with aCOP>1 and recover heat in part from current, in part also from theenvironment or from waste heat sources with low temperature levels.Apart from the use of coolant-heat pumps, thermoelectric materials arealso suitable which could produce the effect without moving parts andwithout coolant. An ideal situation would be when the cooling functionfor the passenger area (summer operation) could be realized by means ofthe same thermoelectric elements, because then the cooling circuit wouldbe completely eliminated and the switching between heating and coolingwould be accomplished by changing the polarity of the applied voltagewithout mechanical changes.

The approach of the invention makes it possible to accomplish thefunction “heating of the passenger area” with a COP>1 (heat pumpoperation) and to eliminate the separate cooling circuit by electricalswitching to the cooling operation, whereby the COP in the coolingoperation should not be inferior to the COP of a cooling circuit.

The essential feature of a heating and air-conditioning device withutilization of the Peltier effect is a considerably increased heattransfer with the lowest possible temperature differences between fluidand the thermally connected side of the thermoelectric elements. Becausethe efficiency of heat exchangers rapidly reaches its limits, thesolution remains to bring about small driving temperature differences bya significant reduction of the transferred heat flux density. Theassociation between decreasing COPs at greater temperature differencesis much more greatly pronounced in thermoelectrics than in coolingcircuits, because undesirable heat conduction in a natural heat flowdirection occurs between the warmer and cooler side of a Peltierelement. A few Kelvin in the cooling operation can already constitutethe difference between an acceptable use and a no longer economic oreven a physically no longer possible configuration, because thefollowing feedback mechanism is present: Rather poor COPs cause agreater amount of heat on the waste heat side and increase thetemperature there, which in turn worsens the COP and further increasesthe power requirement and heat amount on the waste heat side.

During the reduction of the power density, one cannot simply reduce thesupplying of current to the thermoelectric element, because here the COPwould worsen severely, and the elements remain as undesirable thermalbridges between the hot and cold side. The employed semiconductorsusually have thermal conductivities in the single-digit range (W/m2K).Instead, the Peltier elements must be supplied with an optimal currentstrength to be calculated or as a characteristic diagram to be provided,and for reducing the power density may only occupy a small portion ofthe area of their particular integration-surface layer. The portions ofthe area not occupied by the thermoelectric material are to be filled,for example, with insulation material, with air, or with gas, as isshown in FIG. 7.

The low power density based on a surface layer of Peltier elements mustbe compensated in the remaining dimension by successive layers as closeas possible, so that overall an acceptable volumetric power density isavailable and the combination heating/cooling device is not built toolarge, as is shown in FIG. 8. The air channels are naturally ribbed,even if no ribs are shown in FIG. 8.

The desired advantages and effects can be amplified by countercurrentflow of the passenger area air and coolant, as is shown in FIG. 8, andby material connection of the individual layers, as is shown in FIG. 9.Thus, for instance, a bonding application of a very thin electricalinsulation layer to the conductor layer can occur. Ideally, in everylayer toward each side, successive layers are connected by materialbonding and made only as thick as absolutely necessary to fulfill theirtask: Peltier element->electrical conductor->electricalinsulator->bottom of the flow channel (coolant or air side). Asillustrated in FIG. 9, coolant channel 120, which can be provided withbaffles, turbulators, and the like, is attached thermally on both sidesto thermoelectric elements. A further advantage of this configuration isthe modular structure and the possibility provided thereby by suitableadjustment of the number of layers and choice of the planar dimensionsto develop decentralized components, which can be placed close to theparticular outlet openings in the front or rear area.

During cold operation with a 1200 W cooling capacity, 15° C. exhausttemperature, 35° C. coolant temperature, dimensions of 150×150×300 mm³,10 coolant layers, realistic air and coolant flows, and suitablethermoelectric material, a=>COP=Q_(cold)/P_(electric)=2 can be realized.

The heating and cooling unit is designed so that the maximum COP at oneor more relevant operating points can be approximated as closely aspossible. At a lower power requirement, therefore a reduced currentsupply, the COP would worsen, because the Peltier elements actincreasingly as a natural thermal bridge. Therefore, after values fallbelow a certain power level, individual layers are separated not onlyelectrically, but also thermally from the air stream in that, e.g.,flaps close the inlet. This possibility can be realized for a certainnumber of individual layers, or also overlapping for a number of layers.A finer gradation improves the COP over the operating cycle, and arougher gradation reduces the cost of production.

For example, 12 layers can be provided in a heating and cooling unit. Ofthese, in the case of a total of 6 layers, 3 layers each can be closedjointly on the air side. Thus, 2 flaps are needed. The number ofsimultaneously passed-through layers can therefore assume the followingvalues: 6 layers if two flaps are closed, 9 layers if one flap isclosed, and 12 layers if all flaps are open.

Further, the component is to be dimensioned so that during heat-up orcool-down, i.e., during heating and cooling, the required heating orcooling performance can be achieved, independent of the COP achieved inthese phases.

FIG. 11 shows a vertical projection of two adjacent Peltier elementlayers in a view plane, according to an exemplary embodiment of thepresent invention. Shown is a front Peltier element layer, the top layerin FIG. 11, with a plurality of schematically shown Peltier elements600. For the sake of clarity, only one of the plurality of Peltierelements 600 is provided a reference character 600. Further, a backPeltier element layer is shown with a plurality of schematically shownPeltier elements 1600. Peltier elements 1600 are shown by broken lines.For the sake of clarity, only one of the plurality of Peltier elements1600 is again provided with a reference character 1600.

According to this exemplary embodiment, the front Peltier element layerand the back Peltier element layer have a different number of Peltierelements 600, 1600. By way of example, the front Peltier element layerhas 16 Peltier elements 600 and the back Peltier element layer 9 Peltierelements 1600. Moreover, Peltier elements 600 have a differentarrangement on the front Peltier element layer than Peltier elements1600 on the back Peltier element layer. Shown is a staggered arrangementin which a row or column with Peltier elements 600 alternates with a rowor column with Peltier elements 1600. In this regard, Peltier elements600 have no overlapping areas relative to Peltier elements 1600.According to this exemplary embodiment, Peltier elements 600 and Peltierelements 1600 each have the same size. Peltier elements 600, 1600 can beidentical. Alternatively, Peltier elements 600, 1600 can be different insize.

Ideally, in each case a surface of a Peltier element layer has ahomogeneous temperature distribution. In reality, however, correspondingtemperature maxima or temperature minima, so-called hot spots and coldspots, develop at Peltier elements 600, 1600, which represent heatsources or heat sinks. This is caused by the fact that the horizontalheat conduction is limited. The planar arrangement and number of Peltierelements 600, 1600 and in addition or alternatively, the element size ofPeltier elements 600, 1600 can vary between two adjacent Peltier elementlayers. This can result in the advantage of reducing the formation ofhot spots or cold spots, in that the heat sources or heat sinks, which,for example, act on a ribbing, turbulators, or a fluid, in theconceptual vertical projection, shown in FIG. 11, of both Peltierelement layers on a projection area increase in number and have smallerdistances.

The described exemplary embodiments have been selected only by way ofexample and can be combined with one another. Particularly, acombination of the exemplary embodiments with Peltier element layersmade up of individual Peltier element conductors and the exemplaryembodiments with Peltier element layers made up of Peltier elements ispossible. In this regard, the electrical interconnection of the Peltierelement layers can be adjusted accordingly.

The invention being thus described, it will be obvious that the same maybe varied in many ways. Such variations are not to be regarded as adeparture from the spirit and scope of the invention, and all suchmodifications as would be obvious to one skilled in the art are to beincluded within the scope of the following claims.

1. A temperature control element for a vehicle, the temperature controlelement comprising: a first Peltier element layer; a second Peltierelement layer; a first electrically conductive heat conductor layer forconducting a first heat transfer fluid; and a second electricallyconductive heat conductor layer for conducting a second heat transferfluid, wherein the first Peltier element layer, the second Peltierelement layer, the first heat conductor layer, and the second heatconductor layer are arranged in the form of a stack such that the firstheat conductor layer and/or the second heat conductor layer are arrangedbetween the first Peltier element layer and the second Peltier elementlayer, and wherein an electric current conducted through the stackbrings about a temperature control of the first heat conductor layer andthe second heat conductor layer due to a Peltier effect.
 2. Thetemperature control element according to claim 1, further comprising anadditional first electrically conductive heat conductor layer and/or anadditional second electrically conductive heat conductor layer, which isarranged in the stack separated by at least one of the first Peltierelement layer or second Peltier element layer from the first heatconductor layer or second heat conductor layer.
 3. The temperaturecontrol element according to claim 1, further comprising an additionalsecond electrically conductive heat conductor layer, wherein the secondheat conductor layer has a first electrical contact and the additionalsecond heat conductor layer a second electrical contact, and wherein thefirst Peltier element layer and the second Peltier element layer arearranged between the second heat conductor layer and the additionalsecond heat conductor layer and the first heat conductor layer isarranged between the first Peltier element layer and the second Peltierelement layer.
 4. The temperature control element according to claim 1,further comprising: an additional first heat conductor layer and anadditional second heat conductor layer, wherein the first heat conductorlayer has a first electrical contact and the additional first heatconductor layer a second electrical contact; and an electrical lineconfigured to connect the second heat conductor layer to the additionalsecond heat conductor layer, wherein the first heat conductor layer andthe second heat conductor layer are arranged between the first Peltierelement layer and the second Peltier element layer, wherein the firstPeltier element layer and the second Peltier element layer are arrangedbetween the additional first heat conductor layer and the additionalsecond heat conductor layer, and wherein a galvanic and thermalinsulation layer is arranged between the first heat conductor layer andthe second heat conductor layer.
 5. The temperature control elementaccording to claim 1, wherein the first Peltier element layer has atleast two first Peltier element conductors arranged adjacent to oneanother and wherein the second Peltier element layer has at least twosecond Peltier element conductors arranged adjacent to one another. 6.The temperature control element according to claim 1, wherein the firstPeltier element layer and the second Peltier element layer each have atleast one first Peltier element conductor and at least one secondPeltier element conductor, which are arranged adjacent to one anotherand connected to one another in an electrically conductive manner sothat the electric current conducted through the stack flows seriallythrough the first Peltier element conductor and second Peltier elementconductor.
 7. The temperature control element according to claim 1,wherein the first heat conductor layer is configured as a coolantchannel and the second heat conductor layer is configured as a ribelement.
 8. The temperature control element according to claim 1,wherein the first heat conductor layer on an outer side has a galvanicinsulation layer, which is surrounded by a conductor layer, which isconfigured to enable a current flow between the first Peltier elementlayer and the second Peltier element layer.
 9. The temperature controldevice according to claim 3, wherein a plurality of temperature controlelements are interconnected in a series connection via respective firstcontact and second contact.
 10. The temperature control device accordingto claim 8, wherein a galvanic insulation layer is arranged between twoeach of the plurality of temperature control elements.
 11. A temperaturecontrol device for a vehicle, the temperature control device comprising:a first heat conductor layer for conducting a first heat transfer fluid;a Peltier element layer that has a plurality of Peltier elements, whichare arranged spaced apart from one another and in each case comprise aplurality of Peltier element conductors; and a second heat conductorlayer for conducting a second heat transfer fluid, wherein the layersare arranged in the form of a stack such that the Peltier element layerare arranged between the first heat conductor layer and the second heatconductor layer.
 12. The temperature control device according to claim11, wherein the plurality of Peltier elements covers a maximum of atenth of a total area of the Peltier element layer.
 13. The temperaturecontrol device according to claim 11, further comprising an additionalPeltier element layer, which has a plurality of additional Peltierelements, which are arranged spaced apart from one another and in eachcase comprises a plurality of additional Peltier element conductors andan additional first heat conductor layer for conducting the first heattransfer fluid, wherein the additional Peltier element layer is arrangedin the stack between the second heat conductor layer and the additionalfirst heat conductor layer.
 14. The temperature control device accordingto claim 11, further comprising: a thermal insulation layer; anadditional first heat conductor layer for conducting the first heattransfer fluid; and an additional Peltier element layer, which has aplurality of additional Peltier elements, which are arranged spacedapart from one another and in each case comprise a plurality ofadditional Peltier element conductors, wherein the thermal insulationlayer is arranged in the stack adjacent to the second heat conductorlayer and the additional first heat conductor layer in the stack betweenthe thermal insulation layer and the additional Peltier element layer.15. The temperature control device according to claim 11, furthercomprising a switching device, which is configured to conduct the secondheat transfer fluid in a first operating mode of the temperature controldevice or temperature control element through the second heat conductorlayer and an additional second heat conductor layer and in a secondoperating mode of the temperature control device either through thesecond heat conductor layer or through the additional second heatconductor layer.